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NPI
& Prototyping
Pactron
offers its clients a comprehensive approach to New Product Prototyping
– typically picking up the new product design at the schematic
stage and delivering a small number of tested prototypes on a quick
turnaround basis. On the design and layout phase, Pactron deploys
an integrated design platform that includes board simulation to
ensure the design’s signal integrity.
With
a majority of operations performed in-house - at a high degree of
efficiency, Pactron achieves a very high level of customer satisfaction
on both quality as well as its delivery commitments.
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Schematic Capture
Pactron can process schematics in a variety of industry standard
tools, including ORCAD and Cadence Concept. If required, Pactron
will engineer the schematic from block diagrams supplied by the
customer.
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Board Layout of Design Platforms
Pactron’s design team is highly proficient in a variety of
layout technologies, including High Speed design and Analog RF design.
Pactron offers its customers a choice of Cadence Allegro and Mentor
PADS as platforms for design layout.
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Signal
Integrity Analysis
Pactron deploys Cadence’s simulation tool, SpectraQuest for
both pre and post route analysis. Deploying the signal integrity
check, particularly for complex designs, can cut down on the total
development cycle by reducing the risk of prototype “re-spins”.
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DFM
Pactron deploys the ECAM tool to surface DFM issues at both the
PCB as well as assembly levels.
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DFT
Pactron recommends the implementation of JTAG Boundary for board
test. Pactron will implement the requisite Scan-Chain in the design
and develop the necessary programs to ensure maximum test coverage.
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Procurement
& Kitting
Pactron’s NPI services draws on its full fledged ERP backed
Material Management system that coordinates the timely procurement
of all components required for the prototype kit. Pactron has broad
access and longstanding relationships with component distributors
and manufacturers to help track down and procure long lead time
parts in a timely manner. Pactron audits and qualifies its key suppliers,
particularly its PCB vendors, on a frequent basis to ensure superior
quality and technical compliance.
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Assembly
Pactron’s highly experienced manufacturing staff in conjunction
with its state-of-the-art assembly shop is well equipped to respond
to the most challenging of board assemblies. A short list of assembly
capabilities is listed below.
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Fine pitch assembly down to 0201 size components
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High accuracy placement – down to 12mil pitch devices
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Sequential assembly for systematic board bring-up
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uBGA Assembly, Rework, X-Ray
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BGA, uBGA placement, re-ball and rework
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High intensity X-Ray inspection – including metallic BGAs
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Test
& Debug
Pactron recommends JTAG testing for boards that have BGA devices,
particularly BGA devices with a fine pitch and/or a high pin count.
Pactron will implement the scan chain during the design layout phase
to maximize test coverage. Pactron will also develop the test program
for testing and debugging the assembled prototype, thus ensuring
the delivery of a prototype set that is fully tested and ready to
power-up for functional evaluation. Flying probe test is another
option that Pactron offers its board prototype clients.
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