Equipment and Tools

Philips Topaz-X Modular High Speed SMD Mounter
- 18000 cph max. placement speed
- 0201 to 32 mm2 QFP/BGA down to 20mil lead pitch
- 20" x 18" max. board size

Philips CSM Comet High Speed Chip Shooter
Full Vision System with 32 Head Machine. Handling Devices from 0402 Chip up to 208 QFP, Lead Pich Down to 12 Mil. Speed rate over 15,000 C.P.H.

Philips CSM Eclipse Pick & Place Machine
Accuracy Advanced Cyber Optics Equipped with Two Types of Laser Scanner and CCD Vision Systems. Handling Devices from 0402 chip up to 54mm BGAs pitch down to 12 Mil. Speed rate up to 5,500 C.P.H.

Philips CSM 84VZ Pick & Place Machine
18" x 16" with "Vision" Camera System Placement Rate up to 7500 C.P.H.

Philips CSM 84 Pick & Place Machine
Up to 8000 C.P.H. Working C.P.H. Working Area of 18" x 16" Board Size.

Speedline SPM Solder Paste Printer
Precision ultra-pitch Stencil Printer. Pentium bases PC control system with precision print head and Automatic Vision and Automatic Stencil Wiper, the SPM can easily print down to 12 mil pitch, or better in some applications. Printing area up to 20" X 19".

M.P.M SP-20 Stencil Solder Paste Printer
Features an all air logic system for machine control. A double blade squeegee provides consistent print uniformity for boards of varying size. Printing area up to 14" X 16".

Hollis Wave Solder Machine, Model Future 1
Has both Top and Bottom Pre-Heat. Maximum Board Size 16" Wide.

Glenbrook RTX-113 X-Ray Inspection System for BGAs
A high resolution system for real time imaging of assembled boards including BGA, uBGA components. Features 45 degree variable angle viewing, Image enhancer, and BGA Analyzer software.

Metcal / OK Industries BGA 3500 Rework Station
A self contained, high-precision workstation that incorporates the multi-step BGA rework process: Removal, clean-up/Preparation, Stencil printing, Placement and Reflow. Central to the system is a Micro Oven that creates the reflow process with the accurate temperature profile required to remove and replace the BGA/uBGA component. Tools includes CCD vision camera with 10-50X zoom.

Westek Clean D.I. Water Cleaning System
Model Formula II. Maximum Board Width 18".

Heller Industries 1500 Reflow System
100% Forced Convection Reflow New Technology System.
5 Upper Zone and 5 Lower Zone.
Computer Profile Control.

Heller Industries 952C Reflow System
Six Upper and Lower Heat Zone, Utilizes Forced Air Convection Heating Technology.

Other Equipments
Desco GND A98150 Touch Tester. Self Test.
GPD CF-7 Resistor Forming and Cutting Machine.
Heller D277 IC Forming and Cutting Machine.
Hepco 1500-1 Radial Lead Cutter.
Hepco 7000 IC Lead Cutter.
Hepco 7600 IC Lead Cutter.
Q-Corp Mass Lead Trimmer.
Blue M Bare Board Pre-Assembly Baking Chamber.
National Control Electronic Automatic Parts Scale.
Two Meiji Microscopes.